Lingnan University and CIITS officials signing the cooperation agreement for technological innovation collaboration.
News Technology & Innovation

Lingnan University and CIITS Strengthen Technological Collaboration in the Greater Bay Area

On January 16, 2025, Lingnan University’s School of Interdisciplinary Studies (SIS) and the Center for International Innovation for Technology and Science (CIITS) signed a Cooperation Framework Agreement at the InnoBay · Future Industry Forum held at the Shenzhen Park of Hetao Shenzhen-Hong Kong Science and Technology Innovation Cooperation Zone. This collaboration aims to accelerate scientific advancements and promote the industrialisation of cutting-edge research in fields like biomedicine and high-performance materials.

The partnership will focus on developing research centres and labs, advancing key projects, and exploring opportunities for collaboration with leading enterprises. In addition, they will work towards building large-scale scientific infrastructure and establish an innovation fund to support emerging tech startups. A significant part of the agreement involves the exchange of resources and the creation of seminars and industry-focused activities aimed at fostering creative environments and driving research innovation.

Prof. Chen Xi, Dean of SIS at Lingnan University, and Mr. Liu Renchen, Director of CIITS, formalized the agreement, with support from key figures like Prof. Xin Yao, Vice-President (Research and Innovation) at Lingnan University, who highlighted the importance of a globally oriented platform for technological transformation.

This new collaboration promises to be a catalyst for the growth of Greater Bay Area innovation, with Lingnan University leveraging its academic prowess and CIITS contributing its industrialisation expertise to bridge the gap between research and real-world applications. The joint effort seeks to create new business models and drive regional technological advancements for the future.

LEAVE A RESPONSE

Your email address will not be published. Required fields are marked *